Musashi Dispensers | FA Systems

FA Systems

		BGA Underfill FAD5100 Dedicated to Underfill Process Easy Operation & High Throughput
		Better Productivity to up 200% with AeroJet Dispense Shape Check Function Constant dispense amount Easy Set-Up

		LED Encapsulation TAD1000 Dedicated to LED Encapsulation Small Footprint as A2 size
		World First!! Fully automated desktop LED Encapsulation system Stable chromaticity with high-quality, stable dispense Less Running Cost Less Space Less Initial Cost

		Coating Master FCD1000 Non Contact, Non Scattering, Automated Coating System
		Masking is unnecessary thanks to Twin Dispense Head Excellent dispense repeatbility with image recognition Meets up to "M" size substrate

		SprayMaster Even Coating Layer
		The spin coater makes it possible spray a constant layer thickness on a wafer As well as wafers, this can also coat a variety of electronic components and substrates

		FAD2300 High-speed dispensing machine with super-precision and super-stability in micro-amount Ready for cutting-edge devices such as stacked package and C4.
		High throughput with super precision Flexible support for various types of works including wide-type substrates Image processing data incorporated with a touch panel Can be integrated into a production line and equipped with loaders and unlorders
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